China Largest Manufacturer factory sales Copper pyrophosphate CAS 10102-90-6 CAS NO.10102-90-6

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Copper pyrophosphate Basic information Pyrophosphate Copper Plating Physical and Chemical Properties Application Synthesis Product Name: Copper pyrophosphate Synonyms: Cupricpyrophosphate,trihydra;pyrophosphoricacid,coppersalt;COPPER (II) PYROPHOSPHATE;COPPER(II) DIPHOSPHATE TETRAHYDRATE;COPPER PYROPHOSPHATE;Diphosphoric acid, copper salt (1:);diphosphoric acid copper salt;CUPRIC PYROPHOSPHATE CAS: 10102-90-6 MF: Cu2O7P2 MW: 301.04 EINECS: 233-279-4 Product Categories: Inorganics Mol File: 10102-90-6.mol   Copper pyrophosphate Chemical Properties Melting point  1140 °C density  4.2 g/cm3 CAS DataBase Reference 10102-90-6(CAS DataBase Reference) EPA Substance Registry System Copper pyrophosphate (10102-90-6)   Safety Information Risk Statements  36/37/38 Safety Statements  26-36/37/39 Hazardous Substances Data 10102-90-6(Hazardous Substances Data) MSDS Information Provider Language Diphosphoric acid copper salt English   Copper pyrophosphate Usage And Synthesis Pyrophosphate Copper Plating Pyrophosphate copper plating is widely used copper plating process, which has been used in many electroplating plants in china. This process is characterized by its stability of plating solution, meticulous crystalline coating, a better dispersion ability and coverage ability than that of acidic copper plating and higher cathodic current efficiency than cyanide copper plating. And a thick coating can be obtained with no irritating gas escaping from the electroplating process, which can spare the ventilation equipment. Its bath solution is non-toxic, not corrosive to equipment, which makes it especially suitable for circuit printing and zinc alloy die castings. However, the preparation cost of the plating solution is high, and the long-term use (usually within a few years) will cause the accumulation of orthophosphate, so that the deposition rate will decrease significantly. In addition, direct pyrophosphate copper plating on the kinds of metal base with  low electric potential such as steel, aluminum alloy and zinc alloy, will fail without preplating or pretreatment, which ensures the bonding force between the coating and the substrate. Copper pyrophosphate, which is the main raw material for the preparation of copper plating bath, is mainly used for non-cyanide plating. It reacts in the bath with potassium pyrophosphate, the complexing agent, to form pyrophosphate copper ligand ion:  Cu2P2O7+3K4P2O7 = 2K6[Cu (P2O7) 2]; c→6K++[Cu (P2O7) 2]6- Copper content in plating bath has a significant effect on the cathodic polarization and current density range. The copper content in plating bath is controlled at 22~27g/L in the common copper plating, and 27~35g/L for bright copper plating. Low copper content will give a low deposition rate, a narrow current density range allowed and poor brightness and smoothness; and high copper content will decrease the cathode polarization and result in a rough plating coat. In this case, to get a good coating, a corresponding increase in the content of potassium pyrophosphate is needed, but it will also increase the viscosity of the plating solution and thus reduce the conductive ability and dispersion ability of the plating bath； and the plating solution loss adhered to workpiece surface will be increased, resulting in the increase of production cost and the burden of wastewater treatment. Because of its complexation effect on divalent bivalent copper ion and tetravalent tin ion, potassium pyrophosphate is the main complexing agent in the bath. In addition to the copper complex, there must be free to keep a certain amount of potassium pyrophosphate in the plating bath to make the complex more stable and prevent copper pyrophosphate from precipitation, therefore to improve the dispersive ability of the bath and ensure the normal dissolution of the anodes. Physical and Chemical Properties Copper pyrophosphate appears as light green powder soluble in acid and not soluble in water. It can react with potassium pyrophosphate to form soluble potassium pyrophosphatecopper(Ⅱ). Application Copper pyrophosphate is mainly used in non-cyanide plating, supplying copper ions in the plating bath. Used in the copper base of decorative maskant and carburization. Used as analytical reagent. Used in the preparation of phosphate pigments. Synthesis Double Decomposition The copper sulfate and the anhydrous sodium pyrophosphate solution are respectively dissolved into solutions of certain concentration. After filtering and purification, the copper sulfate solution is added into the reactor, and a predetermined amount of anhydrous sodium pyrophosphate solution is added dropwise under the stirring for metathesis reaction to form copper pyrophosphate. Control pH between 5 and 5.5. And copper pyrophosphate is obtained after filtration, rinsing with water, centrifugal separation and drying. Chemical Properties used in electroplating copper [HAW93]   Copper pyrophosphate Preparation Products And Raw materials Raw materials Copper(II) sulfate-->Tetrasodium pyrophosphate

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Leader Biochemical Group is a large leader incorporated industry manufacturers and suppliers of advanced refined raw materials From the year of 1996 when our factory was put into production to year of 2020, our group has successively invested in more than 52 factories with shares and subordinates.We focus on manufacture Pharm & chemicals, functional active ingredients, nutritional Ingredients, health care products, cosmetics, pharmaceutical and refined feed, oil, natural plant ingredients industries to provide top quality of GMP standards products.All the invested factories' product lines cover API and intermediates, vitamins, amino acids, plant extracts, daily chemical products, cosmetics raw materials, nutrition and health care products, food additives, feed additives, essential oil products, fine chemical products and agricultural chemical raw materials And flavors and fragrances. Especially in the field of vitamins, amino acids, pharmaceutical raw materials and cosmetic raw materials, we have more than 20 years of production and sales experience. All products meet the requirements of high international export standards and have been recognized by customers all over the world. Our manufacture basement & R&D center located in National Aerospace Economic & Technical Development Zone Xi`an Shaanxi China. Now not only relying on self-cultivation and development as well as maintains good cooperative relations with many famous research institutes and universities in China. Now, we have closely cooperation with Shanghai Institute of Organic Chemistry of Chinese Academy of Science, Beijing Institute of Material Medical of Chinese Academy of Medical Science, China Pharmaceutical University, Zhejiang University. Closely cooperation with them not only integrating Science and technology resources, but also increasing the R&D speed and improving our R&D power. Offering Powerful Tech supporting Platform for group development. Keep serve the manufacture and the market as the R&D central task, focus on the technical research.  Now there are 3 technology R & D platforms including biological extract, microorganism fermentation and chemical synthesis, and can independently research and develop kinds of difficult APIs and pharmaceutical intermediates. With the strong support of China State Institute of Pharmaceutical Industry (hereinafter short for CSIPI), earlier known as Shanghai Institute of Pharmaceutical Industry (SIPI), we have unique advantages in the R & D and industrialization of high-grade, precision and advanced products.  Now our Group technical force is abundant, existing staff more that 1000 people, senior professional and technical staff accounted for more than 50% of the total number of employees, including 15 PhD research and development personnel, 5 master′ S degree in technical and management personnel 9 people. We have advanced equipment like fermentation equipment and technology also extraction, isolation, purification, synthesis with rich production experience and strict quality control system, According to the GMP required, quickly transforming the R&D results to industrial production in time, it is our advantages and our products are exported to North and South America, Europe, Middle East, Africa, and other five continents and scale the forefront in the nation, won good international reputation.  We believe only good quality can bring good cooperation, quality is our key spirit during our production, we are warmly welcome clients and partner from all over the world contact us for everlasting cooperation, Leader will be your strong, sincere and reliable partner in China.

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Copper pyrophosphate Basic information Pyrophosphate Copper Plating Physical and Chemical Properties Application Synthesis Product Name: Copper pyrophosphate Synonyms: Cupricpyrophosphate,trihydra;pyrophosphoricacid,coppersalt;COPPER (II) PYROPHOSPHATE;COPPER(II) DIPHOSPHATE TETRAHYDRATE;COPPER PYROPHOSPHATE;Diphosphoric acid, copper salt (1:);diphosphoric acid copper salt;CUPRIC PYROPHOSPHATE CAS: 10102-90-6 MF: Cu2O7P2 MW: 301.04 EINECS: 233-279-4 Product Categories: Inorganics Mol File: 10102-90-6.mol   Copper pyrophosphate Chemical Properties Melting point  1140 °C density  4.2 g/cm3 CAS DataBase Reference 10102-90-6(CAS DataBase Reference) EPA Substance Registry System Copper pyrophosphate (10102-90-6)   Safety Information Risk Statements  36/37/38 Safety Statements  26-36/37/39 Hazardous Substances Data 10102-90-6(Hazardous Substances Data) MSDS Information Provider Language Diphosphoric acid copper salt English   Copper pyrophosphate Usage And Synthesis Pyrophosphate Copper Plating Pyrophosphate copper plating is widely used copper plating process, which has been used in many electroplating plants in china. This process is characterized by its stability of plating solution, meticulous crystalline coating, a better dispersion ability and coverage ability than that of acidic copper plating and higher cathodic current efficiency than cyanide copper plating. And a thick coating can be obtained with no irritating gas escaping from the electroplating process, which can spare the ventilation equipment. Its bath solution is non-toxic, not corrosive to equipment, which makes it especially suitable for circuit printing and zinc alloy die castings. However, the preparation cost of the plating solution is high, and the long-term use (usually within a few years) will cause the accumulation of orthophosphate, so that the deposition rate will decrease significantly. In addition, direct pyrophosphate copper plating on the kinds of metal base with  low electric potential such as steel, aluminum alloy and zinc alloy, will fail without preplating or pretreatment, which ensures the bonding force between the coating and the substrate. Copper pyrophosphate, which is the main raw material for the preparation of copper plating bath, is mainly used for non-cyanide plating. It reacts in the bath with potassium pyrophosphate, the complexing agent, to form pyrophosphate copper ligand ion:  Cu2P2O7+3K4P2O7 = 2K6[Cu (P2O7) 2]; c→6K++[Cu (P2O7) 2]6- Copper content in plating bath has a significant effect on the cathodic polarization and current density range. The copper content in plating bath is controlled at 22~27g/L in the common copper plating, and 27~35g/L for bright copper plating. Low copper content will give a low deposition rate, a narrow current density range allowed and poor brightness and smoothness; and high copper content will decrease the cathode polarization and result in a rough plating coat. In this case, to get a good coating, a corresponding increase in the content of potassium pyrophosphate is needed, but it will also increase the viscosity of the plating solution and thus reduce the conductive ability and dispersion ability of the plating bath； and the plating solution loss adhered to workpiece surface will be increased, resulting in the increase of production cost and the burden of wastewater treatment. Because of its complexation effect on divalent bivalent copper ion and tetravalent tin ion, potassium pyrophosphate is the main complexing agent in the bath. In addition to the copper complex, there must be free to keep a certain amount of potassium pyrophosphate in the plating bath to make the complex more stable and prevent copper pyrophosphate from precipitation, therefore to improve the dispersive ability of the bath and ensure the normal dissolution of the anodes. Physical and Chemical Properties Copper pyrophosphate appears as light green powder soluble in acid and not soluble in water. It can react with potassium pyrophosphate to form soluble potassium pyrophosphatecopper(Ⅱ). Application Copper pyrophosphate is mainly used in non-cyanide plating, supplying copper ions in the plating bath. Used in the copper base of decorative maskant and carburization. Used as analytical reagent. Used in the preparation of phosphate pigments. Synthesis Double Decomposition The copper sulfate and the anhydrous sodium pyrophosphate solution are respectively dissolved into solutions of certain concentration. After filtering and purification, the copper sulfate solution is added into the reactor, and a predetermined amount of anhydrous sodium pyrophosphate solution is added dropwise under the stirring for metathesis reaction to form copper pyrophosphate. Control pH between 5 and 5.5. And copper pyrophosphate is obtained after filtration, rinsing with water, centrifugal separation and drying. Chemical Properties used in electroplating copper [HAW93]   Copper pyrophosphate Preparation Products And Raw materials Raw materials Copper(II) sulfate-->Tetrasodium pyrophosphate